In recent years, we have been dedicated to the "PCB design and manufacturing integrated service", integrating the existing facilities and industrial R&D capabilities of our "PCB Advanced Manufacturing Service Center", "RF Thin Film Component Laboratory", "Mobile Communication Module Testing and Tuning Laboratory" and "Microwave Communication Component Laboratory".
We have integrated the existing equipment and R&D capabilities of the "PCB Advanced Manufacturing Service Center", "RF Thin Film Component Laboratory", "Mobile Communication Module Test Lab and Tuning Lab" and "Microwave Communication Component Laboratory".
The existing facilities support next-generation communication products, advanced multi-layer millimeter wave substrate materials, testing and packaging, and the development of millimeter wave communication product design and advanced packaging technologies.
We have been developing talents for millimeter wave communication product design and advanced packaging technology.

Microwave Communication Device Laboratory
This laboratory conducts research on substrate development, antenna measurement and design for 5G, high-speed transmission lines, PCB manufacture and assembly with SMT technology.