Professor Fan-Yi Ouyang received her B.Sc and M.S. degree in Engineering and System Science from National Tsing Hua University at Hsinchu, Taiwan and Ph.D. in Material Science and Engineering, from University of California, Los Angeles in USA. Her Ph. D research focused on electromigration and thermomigration in eutectic SnPb and Pb-free flip chip solder joints. She then spent around 3 years at Intel Corporation, Portland Technology Development Center as Quality and Reliability Engineer to evaluate first level interconnect reliability of various Si-Assembly processes on 32 nm technology and develop first-level interconnect processes on 22 nm technology. She then joined the Department of Engineering and System Science at National Tsing Hua University in Hsinchu in 2010. She is currently a Professor in the Department of Engineering and System Science and a joint Professor in the College of Semiconductor Research. She is also Associate Director in the Center for Nanotechnology, Materials Science, and Microsystems at National Tsing Hua University in Taiwan. She received TMS EMPMD Young Leader Professional Development Award in 2014, the Excellent Young Scientist Award of The Materials Research Society-Taiwan in 2020, and the Excellent Young Professional Award of the Taiwan Association for Coating and Thin Film Technology in 2020. Her current research interests include mass transport (diffusion) and interfacial reaction in advanced packaging technology and thin film deposition and characterization. 

Our research interest is in Si-based and diffusion-driven materials science for modern microelectronic, optoelectronic, bio-sensor, and MEMS devices.  The research in our lab currently focuses on the following topics but is not limited to:
● Diffusion mechanism and microstructural evolution under current stressing (Electromigration),  a
temperature gradient(Thermomigration), and a stress gradient (Stress-migration) on the Pb-free solders  utilized in the flip chip and three-dimensional integrated circuits (3D IC) technologies
● Fabrication of nanocrystalline Cu and Ag thin films and their corresponding reliability issues

●Development of metal to metal direct bonding and hybrid bonding technology for heterogeneous integration
● Chemical reaction and kinetic mechanism between under-bump metallization and  low temperature Sn and In-based solders