Jenn-Ming Song is a professor in the Department of Materials Science and Engineering at National Chung Hsing University in Taiwan.  He received his Ph.D. from National Cheng Kung University in 2000.  His research interests encompass advanced interconnect materials, synthesis and applications of nanomaterials, phase transformation and mechanical behavior of advanced materials at bulk and small length scales. He is an Editor for the journal Materials Chemistry and Physics, and serves as the member of editorial advisory board of Microelectronics Reliability.  Prof. Song has received several excellence research awards, including the Ta-You Wu Memorial Award from National Science Council of Taiwan and the outstanding research professor award from the Lee Chang Yung (LCY) education foundation.

Advanced interconnect materials (AIM) Lab was founded in 2004. Our research topics, including the development of novel advanced interconnect materials, synthesis and applications of nanomaterials, direct bonding for 3D IC packaging and heterogeneous integration, as well as interconnection reliability. We are collaborating with the top semiconductor companies, such as TSMC, ASE, and SPIL. AIM lab is one of the innovative places you can learn something about semiconductor packaging.