Electronic Packaging and Green Material Lab
Research Field
Yee-wen Yen is a full Professor of the National Taiwan University of Science and Technology, Department of Materials Science and Engineering. 05,07-09 Outstanding paper award by the Taiwan Printed Circuit Association (2005, 2007-2009), Best Student Paper Award of the 4th International Microsystems Packaging, Assembly and Circuits Technology Conference (2009), and Outstanding Youth Researcher Award from National Taiwan University of Science and Technology (2012). His research interests include phase equilibria and interfacial reactions between lead-free solders and various substrates, thermodynamics and kinetic to a variety of materials-Sn based alloys, electronic packaging, SOFC (Solid oxide fuel cell), chemical plating, nanotechnology, CALPHAD (Calculation of phase diagram-by using "Panda"), bulk metallic glass (BMG), and high entropy alloys (HEAs). He is author and co-author of 71 papers published in SCI International scientific journals (2005-2021), and more than 76 times attending international conferences.
I focus on the interfacial reactions, phase equilibria, inter-diffusion, surface morphologies, and reaction paths in view of thermodynamics and kinetics. The systems I study include leader-free solders and substrates or interconnect materials in solid-oxide-fuel-cell (SOFC), such as Sn-Ag-Cu, Sn-Zn-Ag, Sn-Cu-Au, or Fe-Cr-Ni, etc. Besides these research topics, I am also concerned with the phase equilibria among the material systems I mentioned above. I tried to establish the thermodynamics database of different material systems by experimental methods and calculations with Panda. I also try to develop a novel method to synthesize carbon nanotubes (CNTs). Due to my former work experience, I investigate the thermal stability between thin films in TFT-LCD, especially for a Cu metallization case. Meanwhile, I am also interested in CALPHAD (Calculation of Phase Diagram) method to predict the Bulk Metallic Glass (such as Zr-based and Cu-based systems) and High Entropy Alloys.
- Phase equilibria and interfacial reaction between lead-free solders and substrates
- Thermodynamics and kinetic to a variety of materials
- Thin film deposition
- Nanotechnology
- CALPHAD (Calculation of phase diagram)
- Bulk Metallic Glass
- 3D IC Package
- High Entropy Alloys
1995 Award of a fine piece of writing in love letters by Department of Chinese Literature National Tsing Hau University
2000 Outstanding paper award by the Chinese Society for Ruin Science
2000 Scholarship for joining International Conferences by K T Li Foundation of the Development of Science and Technology
2000 Outstanding paper prize of Students by the Chinese Society for Materials Science2001 Sandwich Scholarship by NSC (Taiwan) and DAAD (Germany)
2003 An honorary member of The Phi Tau Phi Scholastic Honor Society of the Republic of China
2005,2007, 2008 Outstanding paper award by the Taiwan Printed Circuit Association
2006 TMS Young Leader Program award
Ph.D. NTHU Chemical Engineering (1997.09-2002.09)
M.S NTHU Chemical Engineering (1995.09-1997.06)
B.S. NTHU Chemical Engineering (1991.10-1995.06)
2 Vacancies
Job Description
Experiment execution, and data analysis
Preferred Intern Education Level
B.S., M.S., and Ph.D.
Skill sets or Qualities
Maintain an optimistic and proactive attitude