Chun-Hao Chen received his Ph.D. degree from the National Taiwan University, Taipei, Taiwan. He was the researcher at Fraunhofer Institute for Reliability and Microintegration IZM, Berlin, Germany. He is now the Assistant Professor of the International College of Semiconductor Technology at National Yang Ming Chiao Tung University. His research interests include IC bonding wire, soldering, and power electronic packaging. 

SIRI Lab, short for System Integration & Reliable Interconnects, is dedicated to semiconductor packaging and system integration. The SIRI Lab at NYCU focuses on advanced research and development in the field of semiconductor packaging, system integration, and reliable interconnect technologies. By exploring next-generation compound semiconductor packaging methods, and robust interconnect designs, the lab strives to address challenges in high-performance and energy-efficient electronic systems.