National Applied Research Laboratory, Taiwan Semiconductor Research Institute

Heterogeneous Chip Integration Division

蔡瀚輝/Hann-Huei Tsai
https://www.tsri.org.tw/main.jsp

Research Field

Microelectronic Engineering

Introduction

Hann-Huei Tsai received his B.S. and M.S. degrees in electrical engineering from National Cheng-Kung University, Taiwan, in 1992 and 1994, respectively. He had worked in Taiwan Semiconductor Manufacture Company as a process integration engineer and section manager from 1996 to 2006. He joined the National Applied Research Laboratories (NARLabs) National Chip Implementation Center (CIC) in 2006 and focused on CMOS heterogeneous chip integration, including MEMS, BioMEMS, mixed-signal, power management and silicon photonics applications. He is now the research fellow and division director of heterogeneous chip integration division in NARLabs Taiwan Semiconductor Research Institute (TSRI). He has published over 50 journal and conference papers and own 37 patents.

The Taiwan Semiconductor Research Institute (TSRI) under the National Applied Research Laboratories (NARLabs) is a consolidation of the National Chip Implementation Center (CIC) and National Nano Device Laboratories (NDL). An integrated research environment for related fields of study in Taiwan is urgently required to enhance the overall cultivation of quality talents in response to the introduction of the 3-nm node and rapid development of new applications (e.g., artificial intelligence, quantum computers, next-gen magnetic random access memory, high-speed computers, and 5G network). To keep pace with international technology trends as well as draw on the foundation of an advanced semiconductor research environment established by the industry, academic, and research sectors in Taiwan over the past three decades, the CIC and NDL officially consolidated to form the TSRI in January 2019 with the hope of creating an integrated semiconductor research environment in which world-class academic research and innovative technological development can be conducted to sustain the competitiveness of the semiconductor industry in Taiwan.


Research Topics

1. 2.5D/3D chiplet heterogeneous integration;
2. smart sensor developments;
3. sensing readout and power management circuits;
4. silicon photonics;
5. cryogenic circuits


Honor

1. First place in Chinese Institute of Electrical Engineering Youth Paper Award (1994)
2. The Phi Tau Phi Scholastic Honor(1994)
3. Taipei International Invention Show and Technomart - Invention Competition Silver Medal Award (2014)
4. NARLabs Technical Achievement Award Superior Achievement Award (2010, 2012, 2013)
5. NARLabs Technical Achievement Award Excellent Achievement Award (2015, 2020)


Educational Background

1. 1992~1994 M.S. in Electrical Engineering, National Cheng Kung University
2. 1989~1992 B.S. in Electrical Engineering, National Cheng Kung University


2 Vacancies

Preferred Intern Education Level

1. Undergradulate, Masters or PhD students
2. Major in Microelectronics, Computer Scirence, Mechanics, and Physics

Skill sets or Qualities

1. Experienced in IC design, sensor fabrication or system development
2. Knowledge in semiconductor devices, sensors, and chiplet integration
3. Good team work